The thermal joint conductance, h j, of the interface formed by two conforming, rough surfaces is given by the following simple model proposed by Yovanovich  and further described and used by Antonetti and Yovanovich , Yovanovich and Antonetti , an and Yovanovich . h j = h c + h g. The contact conductance is given by:
Effects of contact pressure, interface temperature, and Mar 01, 2016 · 4. Results and discussion. The effects of surface roughness, contact pressure, and contact interface temperature on TCC were studied. The contact pressure ranged from 2.39 MPa to 15.17 MPa, the interface temperature varied between 360 °C and 640 °C, and the surface roughness R a ranged from 0.25 m to 2.00 m. In each experiment, the contact surfaces had the same R a.
The relationship between total thermal contact conductance and total pressure is founded basic on single contact model, the thermal contact conductance model is simplified and compared with
FEA Based Design and Thermal Contact Conductance a thermal contact conductance model (CMY Model). They consider the resistance to the flow of heat between two thick solid bodies in contact in a vacuum. pressure is the factor of most influence on contact conductance. As contact pressure grows, contact conductance grows (And consequentially, contact resistance becomes
Influence of contact pressure on the thermal contact The thermal contact conductance, , of each h interface at different pressures is shown in . Figure 4, 5 and 6. The thermal contact resistance, ( ), is also plotted in the same graphs for the convenience. Figure 3. Thermal contact conductance and thermal contact resistance (0.1 mm sample) 4. Thermal contact conductance and thermal
The thermal contact conductance, , of each h interface at different pressures is shown in . Figure 4, 5 and 6. The thermal contact resistance, ( ), is also plotted in the same graphs for the convenience. Figure 3. Thermal contact conductance and thermal contact resistance (0.1 mm sample) 4. Thermal contact conductance and thermal
Influence of some interstitial materials on the thermal factors influencing the thermal conductance across the interface. They found the mechanical pressure applied to an interface has a major influence on the resulting thermal contact conductance. The effect was large in the low pressure range (between 0 and approxi-mately 100 psi), but leveled off in the higher pressure range. The
THERMAL BOUNDARY CONDUCTANCE A Materials in thermal interface materials (21). Similarly, TBC is a crucial parameter in phase change materials for data storage (22) as well as in composites for thermal energy storage (23). TBC due to scattering at grain boundaries can also be a limiting factor for heat conduction in nanograined polycrystalline solids.
The magnitude of the contact conductance is a function of a number of parameters including the thermophysical and mechanical properties of the materials in contact, the characteristics of the contacting surfaces, the presence of gaseous or nongaseous interstitial media, the apparent contact pressure, the mean junction temperature, and the conditions surrounding the junction, as noted by
Thermal Contact Conductance in Bolted Joints2.2 Factors In uencing Thermal Contact Conductance Several factors are considered to in uence the thermal contact conductance of a joint in vacuum. Some of these factors involve properties of the two mating materials and some are external variable parameters. The parameters below have been addressed as in uential.
Thermal Contact Conductance in Bolted Jointswith the basic theory of thermal contact conductance. This is followed by a description of the most important factors and established models for thermal contact conductance. The last section of the chapter investigates complications of thermal contact conductance in bolted joints, as opposed to thermal contact conductance between two at plates with
Thermal contact conductance is required to evaluate heat transfer through the interface of two materials and is dependent on a range of material and interface properties. This article provides a brief summary of these properties and a list of thermal contact conductance
Thermal contact conductanceThermal contact conductance is a complicated phenomenon, influenced by many factors. Experience shows that the most important ones are as follows:Contact pressure. The contact pressure is the factor of most influence on contact conductance. As contact pressure grows, contact conductance grows (And consequentially, contact resistance becomes
Thermal contact propertiesGap conductance and gap radiation are enforced in Abaqus/Explicit with an explicit algorithm analogous to the penalty method for mechanical contact interaction. Therefore, gap conductance and gap radiation can influence the stability condition; although in a fully coupled temperature-displacement analysis the mechanical portion of the system usually governs the overall stability condition (see
to determine the factors influencing the thermal conductance across the interface formed between stationary plane surfaces of 75S-T6 aluminum-alloy and AISI Type 416 stainless-steel blocks. The types of joints investigated included bare metal-to-metal contact, contact surfaces separated by a good
Understanding Heat Conduction and the Factors that Here are the factors that affect the rate of conduction:Temperature difference. The greater the difference in temperature between the two ends of the bar, the greater the rate of thermal energy transfer, so more heat is transferred.Thermal Contact Conductancethermal conductance ranges from a factor of 2 for gold coating to an order of magnitude for Indium foil. The improvement gained by insertion of the gold-coated aluminum washer between the contact surfaces was essentially offset by the addition of two extra contact interfaces. In figure 4, thermal conductance of copper contact pairs